PhD in Electrical Engineering - Advancing Sustainable Semiconductor Packaging: Eco-Friendly Materials, Life Cycle Assessment and Manufacturing Innovations

The University of Glasgow is offering a 3.5-year PhD position in Electrical Engineering focused on sustainable semiconductor packaging. The project aims to develop eco-friendly materials and optimize manufacturing processes while conducting Life Cycle Assessments. Candidates will gain hands-on experience with advanced semiconductor packaging equipment and techniques, while learning about material testing and reliability engineering. The position starts on September 1, 2025, and requires full-time commitment.
Start date: 01 September 2025

The School of Engineering of the University of Glasgow is seeking a highly motivated graduate to undertake an exciting 3.5-year PhD project entitled “ Advancing Sustainable Semiconductor Packaging: Eco-Friendly Materials, Life Cycle Assessment and Manufacturing Innovations”

The semiconductor industry plays a crucial role in modern technology but faces significant challenges in environmental sustainability due to the extensive use of hazardous materials and high energy consumption across the supply chain. Semiconductor packaging is essential for protecting and enhancing the performance of integrated circuits. However, traditional packaging materials, such as epoxy resins, lead-based solders, and polymer substrates, contribute to electronic waste and environmental pollution. The semiconductor packaging material is by weight one of the components of ICs and Heterogenous packages.

This PHD projects will develop sustainable semiconductor packaging solutions by investigating sustainable materials, optimising manufacturing processes, and applying Life Cycle Assessments (LCA) to semiconductor packaging solutions. The study will focus on using biodegradable and recyclable materials, reducing the environmental impact in production, and enhancing recyclability without compromising of performance and reliability.

The successful candidate will have access to state-of-the-art semiconductor packaging equipment and develop new low-energy fabrication techniques with additive manufacturing, solvent-free bonding, and advanced deposition methods. You will learn new skills in terms of material selection and testing such as spectroscopy, thermal analysis, and mechanical testing. You will also receive training on LCA to evaluate the environmental impact of new materials and processes using LCA tools to compare carbon footprint, energy use, and recyclability. Finally, you will gain skills in reliability engineering by conducting electrical, thermal, and mechanical testing to ensure the functionality and durability of sustainable packaging solutions

For informal enquiries, and before applying, please email Prof Jeff Kettle (jeff.kettle@gla.ac.uk) and Prof Hadi Heidari (hadi.heidari@glasgow.ac.uk)

Application for this scholarship is made by using the online system at the following link:

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Please note that this application is to gain admission to our PGR programme, and an offer of admission may be issued before a decision on this Scholarship is made. Candidates applying for this Scholarship will most likely have an interview/discussion with the supervisor before any decision is made.