Advanced Packaging Engineer

beBee Careers is seeking an Advanced Packaging Engineer to design and develop complex packaging solutions for multi-die devices. Responsibilities include maintaining product architecture and providing IC packaging expertise. Candidates should have strong experience in IC semiconductor packaging, advanced packaging knowledge, and skills in Cadence EDA tools and SI/EMC analysis. This position offers remote or hybrid working arrangements for flexibility.
About the Role:

The IC Packaging Engineer will be responsible for designing and developing complex packaging solutions for multi-die devices. They will also be involved in maintaining product architecture and providing expertise in IC packaging.

Key Responsibilities:
• Design and develop complex packaging solutions
• Maintain product architecture
• Provide expertise in IC packaging

Requirements:
• Strong IC semiconductor packaging experience
• Advanced packaging knowledge
• Cadence EDA tool expertise
• SI/EMC analysis skills
• Excellent communication skills

Working Arrangements:

This is a remote or hybrid working opportunity that allows for flexibility and work-life balance.